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The 216th SPring-8 Seminar

Subtitle/Subject 1. Detector developments for SLS, SwissFEL and European XFEL 2. EIGER (Extreme hIgh framE Rate detector), a very high frame rate x-ray detector for synchrotron applications
Period from 14:00 to 15:00 Mon., Sep 10 , 2012
Venue Kamitsubo Hall
Format Lecture
Abstract

Speaker : Dr. Bernd Schmitt

Language : ENGLISH

Affiliate : Swiss Light Source, Paul Scherrer Institute

Title : Detector developments for SLS, SwissFEL and European XFEL

Abstract :
The detector group of the Swiss Light Source (SLS) at the Paul Scherrer
Institute is involved in several detector development projects for the SLS and upcoming XFELs (european XFEL at Desy and Swissfel at PSI). In this presentation we give an overview of the detector development projects, challenges for the development and the applications the detectors are developed for.

 

Speaker : Dr. Roberto Dinapoli

Language : ENGLISH

Affiliate : Swiss Light Source, Paul Scherrer Institute

Title : EIGER (Extreme hIgh framE Rate detector), a very high frame rate x-ray detector for synchrotron applications

Abstract :
EIGER is the next generation single photon counting x-ray detector developed at Paul Scherrer Institut for synchrotron based applications. It is a hybrid silicon pixel detector that features a 75x75 µm2 pixel size, a high maximum frame rate capability of ~22 kHz (independent on the detector size), double buffered storage for continuous readout and a negligible dead time between frames of ~3 µs. The chip architecture will be presented first.
Characterization and performance measurements have been done on several single chip detector systems, produced with chips coming from two different lots, both with a lab x-ray source and at the Swiss Light Source. Results on the detector calibration, electronic noise, threshold dispersion, minimum selectable energy threshold, maximum detectable incoming photon flux and maximum frame rate will be presented.
Furthermore, radiation endurance tests with doses up to ~150 Mrad in the sensor and ~60 Mrad in the chip will be shown. These tests prove that the chip is fully functional and suited for multi-chip modules and larger multi-module detectors.
An EIGER module is constructed from a ~4x8 cm2 monolithic sensor bump-bonded to 4x2 readout chips, thus resulting in a 0.5 Mpixel detector.
Several modules can be tiled together to form large area detectors and a 16 Mpixel system is already planned.
The first X-ray images and characterization results of a fully working module assembled with its complete readout electronics will be also presented, as well as an outlook of the planned EIGER detectors.

Organizer : Hidenori Toyokawa
Mail : toyokawa@spring8.or.jp
PHS : 3865

Last modified 2015-05-07 14:24